What causes soldering in die casting dies and thicker diffusions

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Thick diffusion attained by increasing recipe for temp, time, gases.		Thin diffusion attained by decreasing recipe for temp, time, gases.
Macro Photo of thick layer showing with micro-hardness points graphed below		Macro Photo of thin layer showing with micro-hardness points graphed below

Thicker diffusions provides good washout and erosion but are prone to developing thermal cracking which can easily propagate into the base metal.		Thin diffusion zones provide good soldering protection and excellent thermal cracking resistance since they are more flexible.